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Effect of Self-etch Adhesives on Self-sealing Ability of High-Copper Amalgams | ||
| Journal of Dentistry | ||
| مقاله 5، دوره 17، شماره 4، اسفند 2016، صفحه 326-334 اصل مقاله (1.52 M) | ||
| نوع مقاله: Original Article | ||
| نویسندگان | ||
| Saied Mostafa Moazzami* 1؛ Horieh Moosavi1؛ Maryam Modabber2؛ Reza Parvizi3؛ Mohammad Hadi Moayed4؛ Nima Mokhber5؛ Michael Meharry6؛ Reza B Kazemi7 | ||
| 1Dental Research Center and Dept. of Operative and Esthetic Dentistry, School of Dentistry, Mashhad University of Medical Sciences, Mashhad, Iran. | ||
| 2Dept. of Operative and Esthetic Dentistry, School of Dentistry, Yazd University of Medical Sciences, Yazd, Iran. | ||
| 3Postgraduate Researcher, School of Engineering, Faculty of Science and Technology, Deakin University (DU), Geelong, Australia. | ||
| 4Dept. of Materials and Metallurgical Engineering, Ferdowsi University of Mashhad, Mashhad, Iran. | ||
| 5Dept. of Orthodontics, Academic Center of Education, Culture and Research (ACECR), Mashhad, Iran. | ||
| 6Dept. of Restorative Dentistry, Center for Dental Research, Loma Linda University School of Dentistry, Loma Linda, CA, USA. | ||
| 7Dept. of Craniofacial Sciences, Division of General Dentistry, Operative Dentistry-D200, UCONN Health, School of Dental Medicine, Farmington CT, USA. | ||
| چکیده | ||
| Statement of the Problem: Similar to conventional amalgam, high-copper amalgam alloy may also undergo corrosion, but it takes longer time for the resulting products to reduce microleakage by sealing the micro-gap at the tooth/amalgam interface.Purpose: The aim of this study was to evaluate the effect of self-etch adhesives with different pH levels on the interfacial corrosion behavior of high-copper amalgam restoration and its induction potential for self-sealing ability of the micro-gap in the early hours after setting by means of Electro-Chemical Tests (ECTs).Materials and Method: Thirty cylindrical cavities of 4.5mm x 4.7mm were prepared on intact bicuspids. The samples were divided into five main groups of application of Adhesive Resin (AR)/ liner/ None (No), on the cavity floor. The first main group was left without an AR/ liner (No). In the other main groups, the types of AR/ liner used were I-Bond (IB), Clearfil S3 (S3), Single Bond (SB) and Varnish (V). Each main group (n=6) was divided into two subgroups (n=3) according to the types of the amalgams used, either admixed ANA 2000 (ANA) or spherical Tytin (Tyt). The ECTs, Open Circuit Potential (OCP), and the Linear Polarization Resistance (LPR) for each sample were performed and measured 48 hours after the completion of the samples.Results: The Tyt-No and Tyt-IB samples showed the highest and lowest OCP values respectively. In LPR tests, the Rp values of ANA-V and Tyt-V were the highest (lowest corrosion rate) and contrarily, the ANA-IB and Tyt-IB samples, with the lowest pH levels, represented the lowest Rp values (highest corrosion rates).Conclusion: Some self-etch adhesives may increase interfacial corrosion potential and self-sealing ability of high-copper amalgams.Keywords ● Electrochemical Test ● Dental Amalgam ● Corrosion ● Self-etch adhesive; | ||
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